Duke Circuit only provide high quality PCB Assembly services:
1.Surface Mount Technology
We produce all products strict follow IPC2 standards,with more than 8 years experiences on placing BGA,UBGA,CSP and the small package like the 0201 components, for BGA can reach to 0.25mm pitch.
2.Pin Through Hole Assembly
Big Capabilities to place tape and reeled radial components sizes. Maximum PCB size is 100 x 100cm. Placement rates can reach 12000 pieces per hour with about 99% minimizing component loss.
3.Selective Wave Solder
We have the Selective Wave Soldering Machines which can achieves consistent quality and process control when assembling boards having multiple ground,power planes and high-current connectors or A-typical distribution of components.
Both dip-coating and vertical spray coating are available. Those coating can protecte non conductive dielectric layer which was applied onto the printed circuit board assembly to protect the electronic assembly from damage due to contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
5.Complete Turn-Key Service
Complete “Turn-Key Service” Which including materials management of all components, electromechanical parts, plastic parts, cases,print and packaging detail.
.Checks for solder paste
.Checks for components down to 0201 size
.Checks for missing components, offset, incorrect parts, polarity
X-Ray provides high-resolution inspection of:
.Chip scale packages
In-Circuit Testing is commonly used,can find the defects that caused by component problems. Include the following Tests:
.Advanced Function Test
.Flash Device Programming