8 Layer 3+N+3 HDI Board

8 Layer 3+N+3 HDI Boarddukepcb.com team2021-12-15T18:06:52+08:00

8 Layer 3+N+3 HDI Board for POS Device

Characteristic:3 laser,3 lamination, 3+N+3

Thickness:2.5±0.25mm

Min hole diameter:Laser hole :0.2mm Mechanical hole 0.2mm. Aspect ratio:11：1

Min width/space:127/127um

Surface finish:ENIG(0.05um)